Thermal-Relief-Issue-on-Pour

[Moris]

Hello,

in the example picture there is 4-spoke defined on the SMD-components.
The thermal relief on the blue pad on the upper right violates the thermal clearance and DRC rules settings.
Side note: The diagonal route that connects the two blue pads is no thermal relief.

PCB 5.0.0.1

Kind regards

[Alex]

Thank you for the report. This is not bug though. The software creates thermal spokes where possible but doesn't check whether they violate design rules or not. You can either adjust thermal settings or move the trace off the component a bit or move the component off the trace.

[Moris]

Thany your for your answer Alex,
I'm fine when PCB-editor creates thermal relief/spokes not considering DRC rules.
But I would expect PCB-editor to hold the pour-settings. E.g. in the following two picture the pour clearance=0.3mm.
Any manual work around is tedious and may be redone if pour settings change or when components or traces are moved.
Kind regards