Hi, I am not figuring this out. Downloaded a KiCad file for a TI SMPS and when creating a copper pour around all pads of the same potential, it is putting an island around the corner pads. Looking to fill p8 and p14 with copper pour
area of interest is circled in red. island removal settings do not impact copper pour in this area.
I am missing something...
copper pour creating island around pad at same potential
Re: copper pour creating island around pad at same potential
Hard to tell from the screenshot, but there might be some independent copper pieces touching those pads. If not, bring up the
"Copper Pour Properties" dialog window (right-click on its edge and select "Properties..." in the context menu)
and check out the settings under the [Connectivity] tab; specifically, the "Thermals:" settings.
If that doesn't help answer any questions, right-click on the pad and select "Thermal Settings..." in the context menu
to bring up the "Thermal" dialog window. Check to see if the pad has any custom thermal settings that might be causing the problem.
If the mystery persists and you don't need to protect your design, consider posting the DipTrace PCB file here (or a small part of it)
so others can have a crack at helping you troubleshoot the problem.
"Copper Pour Properties" dialog window (right-click on its edge and select "Properties..." in the context menu)
and check out the settings under the [Connectivity] tab; specifically, the "Thermals:" settings.
If that doesn't help answer any questions, right-click on the pad and select "Thermal Settings..." in the context menu
to bring up the "Thermal" dialog window. Check to see if the pad has any custom thermal settings that might be causing the problem.
If the mystery persists and you don't need to protect your design, consider posting the DipTrace PCB file here (or a small part of it)
so others can have a crack at helping you troubleshoot the problem.
Tom