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QFN-40 footprint with solder mask defined vias

Posted: 02 Dec 2018, 23:19
by d1wang
Just made this for MSP430FR58xx. Haven't tested with PCB production.

16 solder masked vias according to TI user guide. TI recommends 0.3mm via diameter with 0.4mm solder mask tent diameter. I use 0.5mm solder mask tent diameter just to be safe.

Add a nasty top-left pad that TI says is present in some packages.