Just made this for MSP430FR58xx. Haven't tested with PCB production.
16 solder masked vias according to TI user guide. TI recommends 0.3mm via diameter with 0.4mm solder mask tent diameter. I use 0.5mm solder mask tent diameter just to be safe.
Add a nasty top-left pad that TI says is present in some packages.
Making your own components and patterns, organizing and using libraries.
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