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Hey Alex,
the plane layers are not always on the internal layers, sometimes you need to build a capacitor with the stack up of the pcb and you need sometimes the external layer as plane. I think it's a good feature you have, but it is just not made completely right.
I think you are trying to create the "Pad removal" feature for the internal layer. You can use this feature to increase the plane area. But you need to remove the pads in the in-layers too.
The problem is sometimes you can't use this feature, because of the component design, especially in High current and High Voltage design. It's ok for that kind of components if pads are round in the in-layer but it's not good if it's done in external layers as well.
You are right, I can create in Signal layer a copper pour, so I can keep the original pads, but I can't use it, because is not possible to overlay to different copper pours without getting problems.
Stefan
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