Hello All,
How do I make an area beneath were my 5v reg. will lay down that will not have any mask, just solder. I want to use this area as my heat sink. Whats the proper name for this also???
Thanks for any help
Howard
5 vdc Reg. Heat Sink Area
Re: 5 vdc Reg. Heat Sink Area
I do this with a copper pour attached to the relevant net, you can make it any shape or size to fit in with the surrounding components.
I doubt that adding solder will have much affect as the copper will do most of the work. Thermal vias can also be added to conduct the heat to the other side of the board or additional area of copper.
I doubt that adding solder will have much affect as the copper will do most of the work. Thermal vias can also be added to conduct the heat to the other side of the board or additional area of copper.
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- Joined: 14 Jun 2010, 15:29
Re: 5 vdc Reg. Heat Sink Area
I'll try it thanks
Howard
-- 20 Jun 2010, 21:01 --
Up-date...I'm not sure that is what I am asking about. I think it is called an "Keep Out Area"...so that no solder mask is put in a specific area.
Thanks
Howard
Howard
-- 20 Jun 2010, 21:01 --
Up-date...I'm not sure that is what I am asking about. I think it is called an "Keep Out Area"...so that no solder mask is put in a specific area.
Thanks
Howard
Re: 5 vdc Reg. Heat Sink Area
If you want to open additional area from solder mask (more than pads area), you can do it in following way:
Select Top Mask or Bottom mask (depending on where heatsink is) from drop-down box on drawing panel. Then choose shape type (filled rectangle, ellipse or polygon) and define its points on design area.
Select Top Mask or Bottom mask (depending on where heatsink is) from drop-down box on drawing panel. Then choose shape type (filled rectangle, ellipse or polygon) and define its points on design area.
Re: 5 vdc Reg. Heat Sink Area
Quick Tip:
With double clap PCBs, you can increase the thermal dissipation by placing a copper pour on the other side below the component side and connecting the two sides by adding through hole pads (assuming they will be plated through). The plated holes will connect the two sides improving the thermal conductivity through the fiberglass.
With double clap PCBs, you can increase the thermal dissipation by placing a copper pour on the other side below the component side and connecting the two sides by adding through hole pads (assuming they will be plated through). The plated holes will connect the two sides improving the thermal conductivity through the fiberglass.