Hi,

I want to place a D2Pack IGBT on the top side of a board and then place .5" copper pours both top and bottom to use as heat sinks/heat transfer pads to move heat from the IGBT to a heat sink on the bottom.

1. Can I use a grid of static vias to transfer the heat from the pad/ top pour to the bottom pour ?

2. How do I keep the pours from being masked and /or plated ? - I want bare copper on the bottom pour to attach a heat sink plate.

Thanks

Bill

1. Of course, you can.
2. Add filled shape on bottom mask layer. Copper pour won't be covered with solder mask on the area, where you added the shape.

Hello,
For my application, I want to cover the copper pour with the solder mask (using it as ground). Kindly help.
Regards,

Copper pour is covered with solder mask by default. It's true until you uncover it by placing custom shape on soldermask layer.