Gaps in copper pour
Gaps in copper pour
I have a board that requires a large copper pour with many vias between layers for grounding and thermal conduction.
In a couple of areas there are ragged gaps in the pour for no apparent reason. Unpouring and repouring results in the same gaps.
I can fill in the gaps by placing another pour over them but it's unhandy.
Has anyone else noticed this?
In a couple of areas there are ragged gaps in the pour for no apparent reason. Unpouring and repouring results in the same gaps.
I can fill in the gaps by placing another pour over them but it's unhandy.
Has anyone else noticed this?
Re: Gaps in copper pour
Try previewing the gerber to see if those gaps are there.. I've seen that before but the gaps aren't really there in any other place but the on-screen display.
Re: Gaps in copper pour
I suggest that you try reducing pour "line width" (in the pour properties) down to 0.008 or 0.010, and see if the pour then looks better to you.
Re: Gaps in copper pour
I will review the gerbers as suggested, thanks.
I tried reducing the pour line width as suggested, and that smoothed out the ragged edges but did not eliminate the gaps.
Even if this is an artifact of the screen generation it is annoying, and it would be nice if it could be fixed in an upcoming release.
I tried reducing the pour line width as suggested, and that smoothed out the ragged edges but did not eliminate the gaps.
Even if this is an artifact of the screen generation it is annoying, and it would be nice if it could be fixed in an upcoming release.
Re: Gaps in copper pour
Try reducing your clearance. If the gap between pads that you want to pass between is 0.045, try setting the clearance to 0.015, for example.
Try setting the vias that you suspect are a problem to the same net as the pour.
These may not solve your problem. In that case, I would check into sending your .dip file to support to see what they suggest. I have not tried more than two layer boards.
Try setting the vias that you suspect are a problem to the same net as the pour.
These may not solve your problem. In that case, I would check into sending your .dip file to support to see what they suggest. I have not tried more than two layer boards.
Re: Gaps in copper pour
If you send the file to support, we can help you.
Re: Gaps in copper pour
It's not that big a deal, I have worked around it.
I just thought I might be missing something simple.
If I get the ok from the boss I'll send in the file so you can take a look.
I just thought I might be missing something simple.
If I get the ok from the boss I'll send in the file so you can take a look.
Re: Gaps in copper pour
You can just post screenshot of the problematic area. If the reason is something simple, we will be able to help you without files.
Re: Gaps in copper pour
Here is a screen shot.
There is another small gap on the left that I didn't mark.
The irregular pour around J1 is a seperate pour, done first.
The main pour is done over it later.
The main pour covered the top of the J1 pour ok, the bottom leaves this gap no matter what I do.
Like I said, I can cover over the gaps with more copper pours, but it's a nuisance.
There is another small gap on the left that I didn't mark.
The irregular pour around J1 is a seperate pour, done first.
The main pour is done over it later.
The main pour covered the top of the J1 pour ok, the bottom leaves this gap no matter what I do.
Like I said, I can cover over the gaps with more copper pours, but it's a nuisance.
- Attachments
-
- Copper pour gaps.jpg (106.27 KiB) Viewed 767 times
Re: Gaps in copper pour
In PCB Layout, I would try Ctrl+A to select everything. See if some little orange squares appear that you would not expect. I am wondering if you might have a Route Keepout shape that you forgot about.