Author Message
 Post subject: Two requests
PostPosted: 29 Mar 2016, 14:26 

Joined: 29 Mar 2016, 13:46
Posts: 2
thank you for a really nice application!

My suggestions:
1) Automatically remove solder mask from copper pour.
2) Automatically adding via-stitching to a copper pour. Vias from a specific via-class with a specific spacing/clearance would be great.

Of all the time spent on my last 2 boards made with Diptrace, 30-40% of the time was spent on manually matching a solder mask cut-out to my 5-10 copper pours, 10-20% of the time was spent to manually add clusters of vias to connect toghether copper pours on both sides of the boards.

Knowing that you might be forced to do the above steps over again might stop you from trying out new ideas and therefore reduces creativity.


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