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 Post subject: ENIG PCBDesign
PostPosted: 21 Jul 2017, 06:58 
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Joined: 06 May 2017, 02:27
Posts: 5
Hi #DipTrace Team
I'm using Diptrace from few months and now I'm designed SMD Board , but during Fabrication the surface finish has been asked.
And according to my research ENIG is said to be the best for SMD Boards.
Now my doubt is, for ENIG surface finishing should the design change? i mean like keeping the Gold pads or any other?
And how should be the pads be changed to support Gold plating or ENIG ?
And if pads are done with ENIG will all the SMD components having copper terminals (or Gold terminated components) to be easily soldered?
Looking forward for positive reply
Thanks

-- 29 Jul 2017, 19:02 --

Awaiting for the reply :roll:


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 Post subject: Re: ENIG PCBDesign
PostPosted: 21 Aug 2017, 13:14 
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Joined: 02 Sep 2013, 09:24
Posts: 27
You do not need to change any pad dimensions for an ENIG surface finish. Enig is very easy to solder two. Keep in mind the ENIG plating is usually only a few uIn thick, and the gold dissolves into the solder during the reflow process.


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