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 Post subject: How do I make thermal relief through-hole pads in DipTrace?
PostPosted: 12 Jul 2017, 11:56 
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Joined: 07 Oct 2016, 23:01
Posts: 11
Example:
Image

Can it be done easily with just a click (i.e. without making each one a project unto itself)?


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 Post subject: Re: How do I make thermal relief through-hole pads in DipTra
PostPosted: 12 Jul 2017, 16:14 
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Joined: 20 Jun 2015, 14:39
Posts: 946
1) Make sure that each pad and/or via that you want connected to the copper pour belongs to the same Net as the copper pour.
2) Right-click on the copper pour's outline, select Properties... in the pop-up menu and choose the [Connectivity] tab in the Copper Pour Properties dialog window.
3) If you want SMD and Through-Hole pads to have thermals, select the desired thermal pattern in the first Thermals: drop-down list.
4) If you want Vias to have thermals, disable the "[ ]Direct Connection for Vias" option and select the desired thermal pattern in the first Thermals: drop-down list. (This will also add thermals to SMD and Through-Hole pads.)
5) If you only want SMD pads to have thermals, select "Direct" in the first Thermals: drop-down list, enable the "[X]Separate Thermals for SMD" option and choose the desired thermal type in the second Thermals: drop-down list.
6) Click on OK and update all copper pours if needed.

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Tom


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